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Study on Numerical Simulation of Mold Filling and Solidification Processes under Pressure Conditions

Xiong, S. / Liu, B. / Jia, L. / Wen, X.

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Study on Numerical Simulation of Mold Filling and Solidification Processes under Pressure Conditions

Xiong, S. / Liu, B. / Jia, L. / Wen, X.

Study on Numerical Simulation of Mold Filling and Solidification Processes under Pressure Conditions

Xiong, S. / Liu, B. / Jia, L. / Wen, X.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Study on Numerical Simulation of Mold Filling and Solidification Processes under Pressure Conditions

Contributors:

Xiong, S. (author) / Liu, B. (author) / Jia, L. (author) / Wen, X. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 18 ; 413-416

Publication date:

2002-01-01

Size:

4 pages

ISSN:

1005-0302

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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