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    Technical note Recovery for SiC~w/6061 aluminium alloy composite chips by hot compression

    New search for: Jiang, C. H.
    New search for: Wang, D. Z.
    New search for: Wu, J. S.

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    Technical note Recovery for SiC~w/6061 aluminium alloy composite chips by hot compression

    New search for: Jiang, C. H.
    New search for: Wang, D. Z.
    New search for: Wu, J. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Technical note Recovery for SiC~w/6061 aluminium alloy composite chips by hot compression

    New search for: Jiang, C. H.
    New search for: Wang, D. Z.
    New search for: Wu, J. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Technical note Recovery for SiC~w/6061 aluminium alloy composite chips by hot compression

    Contributors:

    Jiang, C. H. (author) / Wang, D. Z. (author) / Wu, J. S. (author)

    Published in:

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 19 ; 406-408

    Publication date:

    2003-01-01

    Size:

    3 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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