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Thermal Stresses in a One-Sided Bonded Repair by a Plate Inclusion Model
Thermal Stresses in a One-Sided Bonded Repair by a Plate Inclusion Model
Thermal Stresses in a One-Sided Bonded Repair by a Plate Inclusion Model
Duong, C. N. (author) / Yu, J. (author)
JOURNAL OF THERMAL STRESSES ; 26 ; 457-466
2003-01-01
10 pages
Article (Journal)
English
DDC:
620.1121
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