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Thermal Residual Stresses in Single-sided Bonded Composite Patching

Wang, Z. / Xiao, J. / Jiang, D. / Zeng, J. / Yang, F.

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Thermal Residual Stresses in Single-sided Bonded Composite Patching

Wang, Z. / Xiao, J. / Jiang, D. / Zeng, J. / Yang, F.

Thermal Residual Stresses in Single-sided Bonded Composite Patching

Wang, Z. / Xiao, J. / Jiang, D. / Zeng, J. / Yang, F.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermal Residual Stresses in Single-sided Bonded Composite Patching

Contributors:

Wang, Z. (author) / Xiao, J. (author) / Jiang, D. (author) / Zeng, J. (author) / Yang, F. (author)

Published in:

JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 28 ; 587-600

Publication date:

2009-01-01

Size:

14 pages

ISSN:

0731-6844

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1923

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