Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Wafer Bumping Methods for Attaching Flip Chips Measure Up

    New search for: Allen, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Wafer Bumping Methods for Attaching Flip Chips Measure Up

    New search for: Allen, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Wafer Bumping Methods for Attaching Flip Chips Measure Up

    New search for: Allen, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Wafer Bumping Methods for Attaching Flip Chips Measure Up

    Contributors:

    Allen, M. (author)

    Published in:

    ADVANCED PACKAGING ; 12 ; 26-28

    Publication date:

    2003-01-01

    Size:

    3 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Lead-free Solder Wafer Bumping

    Dimock, F. / Mattson, K. | British Library Online Contents | 2004

    Wafer-level Microbumping for Flip Chips

    Souriau, J.-C. / Franiatte, R. / Mathieu, L. et al. | British Library Online Contents | 2005

    Wafer Bumping An Industry Perspective

    Buchanan, E. | British Library Online Contents | 2004

    Lead-free flip chip bumping with special focus on stud bumping - a flexible and economical flip chip technology

    Norlyng, S. | British Library Online Contents | 2001

    Stencil Printing for Wafer Bumping

    Lasky, R. C. | British Library Online Contents | 2004

    Back to top