A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Wafer-level Microbumping for Flip Chips
Wafer-level Microbumping for Flip Chips
Wafer-level Microbumping for Flip Chips
Souriau, J.-C. (author) / Franiatte, R. (author) / Mathieu, L. (author) / Ponthenier, G. (author) / Sillon, N. (author)
ADVANCED PACKAGING ; 14 ; 20-23
2005-01-01
4 pages
Article (Journal)
English
DDC:
658.564
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