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    Deformation Behavior of Solvent - thermal Debinding in Powder Injection Molding

    New search for: Songlin, L.
    New search for: Shuquan, L.
    New search for: Duxin, L.

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    Deformation Behavior of Solvent - thermal Debinding in Powder Injection Molding

    New search for: Songlin, L.
    New search for: Shuquan, L.
    New search for: Duxin, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Deformation Behavior of Solvent - thermal Debinding in Powder Injection Molding

    New search for: Songlin, L.
    New search for: Shuquan, L.
    New search for: Duxin, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Deformation Behavior of Solvent - thermal Debinding in Powder Injection Molding

    Contributors:

    Songlin, L. (author) / Shuquan, L. (author) / Duxin, L. (author)

    Published in:

    PM TECHNOLOGY -CHINA- ; 21 ; 76-79

    Publication date:

    2003-01-01

    Size:

    4 pages

    ISSN:

    1001-3784

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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