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Thermal Stress Simulation in TiB~2-Cu Functionally Graded Materials

Wang, X. / Zhang, X. / Du, S.

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Thermal Stress Simulation in TiB~2-Cu Functionally Graded Materials

Wang, X. / Zhang, X. / Du, S.

Thermal Stress Simulation in TiB~2-Cu Functionally Graded Materials

Wang, X. / Zhang, X. / Du, S.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermal Stress Simulation in TiB~2-Cu Functionally Graded Materials

Contributors:

Wang, X. (author) / Zhang, X. (author) / Du, S. (author)

Published in:

MATERIALS SCIENCE FORUM ; 423/425 ; 245-248

Publication date:

2003-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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