Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure

    New search for: Osendi, M. I.
    New search for: Miranzo, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure

    New search for: Osendi, M. I.
    New search for: Miranzo, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure

    New search for: Osendi, M. I.
    New search for: Miranzo, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure

    Contributors:

    Osendi, M. I. (author) / Miranzo, P. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 426/432 ; 4075-4080

    Publication date:

    2003-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    INTERPOSING MEMBER AND DECK

    YOKOYAMA SHINJI | European Patent Office | 2020

    Free access

    Solid State Diffusion Bonding of Silicon Nitride Using Vanadium Foils

    Maeda, M. / Igarashi, O. / Shibayanagi, T. et al. | British Library Online Contents | 2003

    INTERPOSING TOOL IN SUPPORT TILE

    FUJII ATSUHIDE | European Patent Office | 2016

    Free access

    Silicon nitride joining for high temperature applications

    Glass, S.J. / Hosking, F.M. / Loehman, R.E. et al. | British Library Online Contents | 1998

    Silicon nitride joining for high temperature applications

    Glass, S. J. / Hosking, F. M. / Loehman, R. E. et al. | British Library Online Contents | 1998

    Back to top