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Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition
Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition
Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition
Seol, K.-W. (author) / Choe, B.-H. (author) / Lee, Y.-K. (author) / Lee, J. K. (author)
MATERIALS SCIENCE FORUM ; 426/432 ; 3715-3720
2003-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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