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    Rapid Directional Solidification with Ultra-High Temperature Gradient and Cellular Spacing Selection of Cu-Mn Alloy

    New search for: Yang, S.
    New search for: Su, Y.
    New search for: Liu, W.
    New search for: Huang, W.
    New search for: Zhou, Y.

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    Rapid Directional Solidification with Ultra-High Temperature Gradient and Cellular Spacing Selection of Cu-Mn Alloy

    New search for: Yang, S.
    New search for: Su, Y.
    New search for: Liu, W.
    New search for: Huang, W.
    New search for: Zhou, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Rapid Directional Solidification with Ultra-High Temperature Gradient and Cellular Spacing Selection of Cu-Mn Alloy

    New search for: Yang, S.
    New search for: Su, Y.
    New search for: Liu, W.
    New search for: Huang, W.
    New search for: Zhou, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Rapid Directional Solidification with Ultra-High Temperature Gradient and Cellular Spacing Selection of Cu-Mn Alloy

    Contributors:

    Yang, S. (author) / Su, Y. (author) / Liu, W. (author) / Huang, W. (author) / Zhou, Y. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 19 ; 225-228

    Publication date:

    2003-01-01

    Size:

    4 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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