Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition: Fid-Bau Portal

Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition

Yang, S. / Su, Y. / Liu, Z. / Huang, W. / Zhou, Y.

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Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition

Yang, S. / Su, Y. / Liu, Z. / Huang, W. / Zhou, Y.

Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition

Yang, S. / Su, Y. / Liu, Z. / Huang, W. / Zhou, Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition

Contributors:

Yang, S. (author) / Su, Y. (author) / Liu, Z. (author) / Huang, W. (author) / Zhou, Y. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 17 ; 85-86

Publication date:

2001-01-01

Size:

2 pages

ISSN:

1005-0302

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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