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    Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

    New search for: Scherban, T.
    New search for: Pantuso, D.
    New search for: Sun, B.
    New search for: El-Mansy, S.
    New search for: Xu, J.
    New search for: Elizalde, M. R.
    New search for: Sanchez, J. M.

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    Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

    New search for: Scherban, T.
    New search for: Pantuso, D.
    New search for: Sun, B.
    New search for: El-Mansy, S.
    New search for: Xu, J.
    New search for: Elizalde, M. R.
    New search for: Sanchez, J. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

    New search for: Scherban, T.
    New search for: Pantuso, D.
    New search for: Sun, B.
    New search for: El-Mansy, S.
    New search for: Xu, J.
    New search for: Elizalde, M. R.
    New search for: Sanchez, J. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

    Contributors:

    Scherban, T. (author) / Pantuso, D. (author) / Sun, B. (author) / El-Mansy, S. (author) / Xu, J. (author) / Elizalde, M. R. (author) / Sanchez, J. M. (author) / Martinez-Esnaola, J. M. (author)

    Published in:

    INTERNATIONAL JOURNAL OF FRACTURE ; 119 ; 421-429

    Publication date:

    2003-01-01

    Size:

    9 pages

    ISSN:

    0376-9429

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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