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    The microstructure and the thermal expansion characteristics of Cu/SiCp composites

    New search for: Shu, K. M.
    New search for: Tu, G. C.

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    The microstructure and the thermal expansion characteristics of Cu/SiCp composites

    New search for: Shu, K. M.
    New search for: Tu, G. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The microstructure and the thermal expansion characteristics of Cu/SiCp composites

    New search for: Shu, K. M.
    New search for: Tu, G. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    The microstructure and the thermal expansion characteristics of Cu/SiCp composites

    Contributors:

    Shu, K. M. (author) / Tu, G. C. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 349 ; 236-247

    Publication date:

    2003-01-01

    Size:

    12 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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