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    TECHNOLOGY APPLICATION SERIES: RESIDUAL STRESS MEASUREMENT USING THE HOLE DRILLING METHOD AND LASER SPECKLE INTERFEROMETRY - PART III: ANALYSIS TECHNIQUE

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    New search for: Steinzig, M.

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    TECHNOLOGY APPLICATION SERIES: RESIDUAL STRESS MEASUREMENT USING THE HOLE DRILLING METHOD AND LASER SPECKLE INTERFEROMETRY - PART III: ANALYSIS TECHNIQUE

    New search for: Ponslet, E.
    New search for: Steinzig, M.

    Access

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    Check availability in my library
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    TECHNOLOGY APPLICATION SERIES: RESIDUAL STRESS MEASUREMENT USING THE HOLE DRILLING METHOD AND LASER SPECKLE INTERFEROMETRY - PART III: ANALYSIS TECHNIQUE

    New search for: Ponslet, E.
    New search for: Steinzig, M.

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    Document information
    Title:

    TECHNOLOGY APPLICATION SERIES: RESIDUAL STRESS MEASUREMENT USING THE HOLE DRILLING METHOD AND LASER SPECKLE INTERFEROMETRY - PART III: ANALYSIS TECHNIQUE

    Contributors:

    Ponslet, E. (author) / Steinzig, M. (author)

    Published in:

    EXPERIMENTAL TECHNIQUES ; 27 ; 45-48

    Publication date:

    2003-01-01

    Size:

    4 pages

    ISSN:

    0732-8818

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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