A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Next-generation Electronics Packaging Using Flip Chip Technology
Next-generation Electronics Packaging Using Flip Chip Technology
Next-generation Electronics Packaging Using Flip Chip Technology
Pascariu, G. (author) / Cronin, P. (author) / Crowley, D. (author)
ADVANCED PACKAGING ; 12 ; 21-28
2003-01-01
8 pages
Article (Journal)
English
DDC:
658.564
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