A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Flip Chip Technologies and Their Applications in MEMS Packaging
Flip Chip Technologies and Their Applications in MEMS Packaging
Flip Chip Technologies and Their Applications in MEMS Packaging
Wang, H.-Y. (author)
2002-01-01
4 pages
Article (Journal)
English
DDC:
515.355
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2008
Lithography for Advanced Packaging Flip chip and WLCSP applications
| British Library Online Contents | 2002
Evolution of Organic Flip Chip Packaging
| British Library Online Contents | 2005
Next-generation Electronics Packaging Using Flip Chip Technology
| British Library Online Contents | 2003
Measurement of Pressure Distribution during MEMS and Flip Chip Encapsulation
| British Library Online Contents | 2011