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Evolution of residual stresses in modified epoxy resins for electronic packaging applications

Sham, M. L. / Kim, J. K.

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Evolution of residual stresses in modified epoxy resins for electronic packaging applications

Sham, M. L. / Kim, J. K.

Evolution of residual stresses in modified epoxy resins for electronic packaging applications

Sham, M. L. / Kim, J. K.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Evolution of residual stresses in modified epoxy resins for electronic packaging applications

Contributors:

Sham, M. L. (author) / Kim, J. K. (author)

Published in:

COMPOSITES PART A ; 35 ; 537-546

Publication date:

2004-01-01

Size:

10 pages

ISSN:

1359-835X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.118

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Investigation of the Adhesive Strength and Residual Stresses in Epoxy Composites Modified by Microwave Electromagnetic Treatment

Stukhlyak, P. D. / Holotenko, O. S. / Dobrotvor, I. H. et al. | British Library Online Contents | 2015