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Behaviors of the interface and matrix for the Ag/Cu bimetallic laminates prepared by roll bonding and diffusion annealing
Behaviors of the interface and matrix for the Ag/Cu bimetallic laminates prepared by roll bonding and diffusion annealing
Behaviors of the interface and matrix for the Ag/Cu bimetallic laminates prepared by roll bonding and diffusion annealing
Zhang, L. (author) / Meng, L. (author) / Zhou, S. P. (author) / Yang, F. T. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 371 ; 65-71
2004-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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