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Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface

Chang, T.-C. / Hon, M.-H. / Wang, M.-C.

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Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface

Chang, T.-C. / Hon, M.-H. / Wang, M.-C.

Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface

Chang, T.-C. / Hon, M.-H. / Wang, M.-C.

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Check availability in my library

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Document information

Title:

Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface

Contributors:

Chang, T.-C. (author) / Hon, M.-H. (author) / Wang, M.-C. (author)

Published in:

MATERIALS TRANSACTIONS ; 45 ; 606-613

Publication date:

2004-01-01

Size:

8 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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