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Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface
Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface
Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface
Chang, T.-C. (Autor:in) / Hon, M.-H. (Autor:in) / Wang, M.-C. (Autor:in)
MATERIALS TRANSACTIONS ; 45 ; 606-613
01.01.2004
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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