Nanotopography impact in shallow-trench isolation chemical mechanical polishing-analysis method and consumable dependence: Fid-Bau Portal

Nanotopography impact in shallow-trench isolation chemical mechanical polishing-analysis method and consumable dependence

Park, J.-G. / Katoh, T. / Paik, U.

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Nanotopography impact in shallow-trench isolation chemical mechanical polishing-analysis method and consumable dependence

Park, J.-G. / Katoh, T. / Paik, U.

Nanotopography impact in shallow-trench isolation chemical mechanical polishing-analysis method and consumable dependence

Park, J.-G. / Katoh, T. / Paik, U.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Nanotopography impact in shallow-trench isolation chemical mechanical polishing-analysis method and consumable dependence

Contributors:

Park, J.-G. (author) / Katoh, T. (author) / Paik, U. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 1783-1790

Publication date:

2004-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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