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    Structural and Electronic Properties of the 6H-SiC(0001)/Al~2O~3 Interface Prepared by Atomic Layer Deposition

    New search for: Seyller, T.
    New search for: Gao, K.
    New search for: Ley, L.
    New search for: Ciobanu, F.
    New search for: Pensl, G.
    New search for: Tadich, A.
    New search for: Riley, J. D.
    New search for: Leckey, R. C. G.

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    Structural and Electronic Properties of the 6H-SiC(0001)/Al~2O~3 Interface Prepared by Atomic Layer Deposition

    New search for: Seyller, T.
    New search for: Gao, K.
    New search for: Ley, L.
    New search for: Ciobanu, F.
    New search for: Pensl, G.
    New search for: Tadich, A.
    New search for: Riley, J. D.
    New search for: Leckey, R. C. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Structural and Electronic Properties of the 6H-SiC(0001)/Al~2O~3 Interface Prepared by Atomic Layer Deposition

    New search for: Seyller, T.
    New search for: Gao, K.
    New search for: Ley, L.
    New search for: Ciobanu, F.
    New search for: Pensl, G.
    New search for: Tadich, A.
    New search for: Riley, J. D.
    New search for: Leckey, R. C. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Order at Subito €

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    Document information
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    Document information
    Title:

    Structural and Electronic Properties of the 6H-SiC(0001)/Al~2O~3 Interface Prepared by Atomic Layer Deposition

    Contributors:

    Seyller, T. (author) / Gao, K. (author) / Ley, L. (author) / Ciobanu, F. (author) / Pensl, G. (author) / Tadich, A. (author) / Riley, J. D. (author) / Leckey, R. C. G. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 457/460 ; 1369-1372

    Publication date:

    2004-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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