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    Effect of Substrate Bias on Nanoindentation Hardness and Microstructure of Polycrystalline Copper Thin Films

    New search for: Fei, W.
    New search for: Kewei, X.

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    Effect of Substrate Bias on Nanoindentation Hardness and Microstructure of Polycrystalline Copper Thin Films

    New search for: Fei, W.
    New search for: Kewei, X.

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    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Substrate Bias on Nanoindentation Hardness and Microstructure of Polycrystalline Copper Thin Films

    New search for: Fei, W.
    New search for: Kewei, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    Effect of Substrate Bias on Nanoindentation Hardness and Microstructure of Polycrystalline Copper Thin Films

    Contributors:

    Fei, W. (author) / Kewei, X. (author)

    Published in:

    RARE METAL MATERIALS AND ENGINEERING ; 33 ; 531-533

    Publication date:

    2004-01-01

    Size:

    3 pages

    ISSN:

    1002-185X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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