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    Electroless Copper Plating Technology for Tungsten Powder

    New search for: Wang, H.
    New search for: Fang, S.-l.
    New search for: Ding, P.

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    Electroless Copper Plating Technology for Tungsten Powder

    New search for: Wang, H.
    New search for: Fang, S.-l.
    New search for: Ding, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Electroless Copper Plating Technology for Tungsten Powder

    New search for: Wang, H.
    New search for: Fang, S.-l.
    New search for: Ding, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Electroless Copper Plating Technology for Tungsten Powder

    Contributors:

    Wang, H. (author) / Fang, S.-l. (author) / Ding, P. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN-. ; 37 ; 22 - 23

    Publication date:

    2004-01-01

    Size:

    2 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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