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    Numerical Modeling of Grain Boundary Effects in the Diffusional Creep of Copper Interconnect Lines

    New search for: Grychanyuk, V.
    New search for: Tsukrov, I.
    New search for: Gross, T.

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    Numerical Modeling of Grain Boundary Effects in the Diffusional Creep of Copper Interconnect Lines

    New search for: Grychanyuk, V.
    New search for: Tsukrov, I.
    New search for: Gross, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Numerical Modeling of Grain Boundary Effects in the Diffusional Creep of Copper Interconnect Lines

    New search for: Grychanyuk, V.
    New search for: Tsukrov, I.
    New search for: Gross, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Numerical Modeling of Grain Boundary Effects in the Diffusional Creep of Copper Interconnect Lines

    Contributors:

    Grychanyuk, V. (author) / Tsukrov, I. (author) / Gross, T. (author)

    Published in:

    INTERNATIONAL JOURNAL OF FRACTURE. ; 127 ; l149-l155

    Publication date:

    2004-01-01

    Size:

    l149-l155

    ISSN:

    0376-9429

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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