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    Overmolded Electronic Assembly Packaging Cost, Reliability and Manufacturing Improvements

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    Overmolded Electronic Assembly Packaging Cost, Reliability and Manufacturing Improvements

    New search for: Brandenburg, S. D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Overmolded Electronic Assembly Packaging Cost, Reliability and Manufacturing Improvements

    New search for: Brandenburg, S. D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Title:

    Overmolded Electronic Assembly Packaging Cost, Reliability and Manufacturing Improvements

    Contributors:

    Brandenburg, S. D. (author)

    Published in:

    ADVANCED PACKAGING ; 13 ; 47-52

    Publication date:

    2004-01-01

    Size:

    6 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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