A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Evaluation of Overmolded Electronic Assembly Packaging Using Thermoset and Thermoplastic Molding
Evaluation of Overmolded Electronic Assembly Packaging Using Thermoset and Thermoplastic Molding
Evaluation of Overmolded Electronic Assembly Packaging Using Thermoset and Thermoplastic Molding
Brandenburg, S. D. (author)
ADVANCING MICROELECTRONICS ; 34 ; 24-29
2007-01-01
6 pages
Article (Journal)
English
DDC:
621.381
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