A platform for research: civil engineering, architecture and urbanism
Modelling the transient liquid phase bonding behaviour of a duplex stainless steel using copper interlayers
Modelling the transient liquid phase bonding behaviour of a duplex stainless steel using copper interlayers
Modelling the transient liquid phase bonding behaviour of a duplex stainless steel using copper interlayers
Padron, T. (author) / Khan, T. I. (author) / Kabir, M. J. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 385 ; 220-228
2004-01-01
9 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Transient liquid phase bonding of a microduplex stainless steel using amorphous interlayers
British Library Online Contents | 2002
|British Library Online Contents | 2004
|Liquid phase bonding of aluminium and aluminium/Nicalon composite using copper interlayers
British Library Online Contents | 1993
|Diffusion bonding of aluminium oxide to stainless steel using stress relief interlayers
British Library Online Contents | 2002
|British Library Online Contents | 2003
|