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Optimization of Thickness Uniformity in Electrodeposition onto a Patterned Substrate

Oh, Y.-j. / Chung, S.-h. / Lee, M.-s.

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Optimization of Thickness Uniformity in Electrodeposition onto a Patterned Substrate

Oh, Y.-j. / Chung, S.-h. / Lee, M.-s.

Optimization of Thickness Uniformity in Electrodeposition onto a Patterned Substrate

Oh, Y.-j. / Chung, S.-h. / Lee, M.-s.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Optimization of Thickness Uniformity in Electrodeposition onto a Patterned Substrate

Contributors:

Oh, Y.-j. (author) / Chung, S.-h. (author) / Lee, M.-s. (author)

Published in:

MATERIALS TRANSACTIONS ; 45 ; 3005-3010

Publication date:

2004-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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