On the Stability of Defects and Grain Size in Ultrafine-Grained Copper during Cyclic Deformation and Subsequent Ageing at Room Temperature: Fid-Bau Portal

On the Stability of Defects and Grain Size in Ultrafine-Grained Copper during Cyclic Deformation and Subsequent Ageing at Room Temperature

Huang, C. X. / Wang, S. C. / Wu, S. D. / Jiang, C. B. / Li, G. Y. / Li, S. X.

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On the Stability of Defects and Grain Size in Ultrafine-Grained Copper during Cyclic Deformation and Subsequent Ageing at Room Temperature

Huang, C. X. / Wang, S. C. / Wu, S. D. / Jiang, C. B. / Li, G. Y. / Li, S. X.

On the Stability of Defects and Grain Size in Ultrafine-Grained Copper during Cyclic Deformation and Subsequent Ageing at Room Temperature

Huang, C. X. / Wang, S. C. / Wu, S. D. / Jiang, C. B. / Li, G. Y. / Li, S. X.

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Title:

On the Stability of Defects and Grain Size in Ultrafine-Grained Copper during Cyclic Deformation and Subsequent Ageing at Room Temperature

Contributors:

Huang, C. X. (author) / Wang, S. C. (author) / Wu, S. D. (author) / Jiang, C. B. (author) / Li, G. Y. (author) / Li, S. X. (author)

Published in:

MATERIALS SCIENCE FORUM ; 475/479 ; 4055-4058

Publication date:

2005-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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