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Effect of cooling rate on the microstructure of Ag-Cu-Sn solder alloys

Snugovsky, L. / Snugovsky, P. / Perovic, D. D. / Rutter, J. W.

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Effect of cooling rate on the microstructure of Ag-Cu-Sn solder alloys

Snugovsky, L. / Snugovsky, P. / Perovic, D. D. / Rutter, J. W.

Effect of cooling rate on the microstructure of Ag-Cu-Sn solder alloys

Snugovsky, L. / Snugovsky, P. / Perovic, D. D. / Rutter, J. W.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of cooling rate on the microstructure of Ag-Cu-Sn solder alloys

Contributors:

Snugovsky, L. (author) / Snugovsky, P. (author) / Perovic, D. D. (author) / Rutter, J. W. (author)

Published in:

MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 21 ; 61-68

Publication date:

2005-01-01

Size:

8 pages

ISSN:

0267-0836

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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