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    Water-soluble binder with high flexural modulus for powder injection molding

    New search for: Song, M.
    New search for: Park, M. S.
    New search for: Kim, J. K.
    New search for: Cho, I. B.
    New search for: Kim, K. H.
    New search for: Sung, H. J.
    New search for: Ahn, S.

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    Water-soluble binder with high flexural modulus for powder injection molding

    New search for: Song, M.
    New search for: Park, M. S.
    New search for: Kim, J. K.
    New search for: Cho, I. B.
    New search for: Kim, K. H.
    New search for: Sung, H. J.
    New search for: Ahn, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Water-soluble binder with high flexural modulus for powder injection molding

    New search for: Song, M.
    New search for: Park, M. S.
    New search for: Kim, J. K.
    New search for: Cho, I. B.
    New search for: Kim, K. H.
    New search for: Sung, H. J.
    New search for: Ahn, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Water-soluble binder with high flexural modulus for powder injection molding

    Contributors:

    Song, M. (author) / Park, M. S. (author) / Kim, J. K. (author) / Cho, I. B. (author) / Kim, K. H. (author) / Sung, H. J. (author) / Ahn, S. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 40 ; 1105-1109

    Publication date:

    2005-01-01

    Size:

    5 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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