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Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433-473K
Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433-473K
Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433-473K
Takenaka, T. (author) / Kano, S. (author) / Kajihara, M. (author) / Kurokawa, N. (author) / Sakamoto, K. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 396 ; 115-123
2005-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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