Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433-473K
Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433-473K
Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433-473K
Takenaka, T. (Autor:in) / Kano, S. (Autor:in) / Kajihara, M. (Autor:in) / Kurokawa, N. (Autor:in) / Sakamoto, K. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 396 ; 115-123
01.01.2005
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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