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Study of movel 70% Si-Al alloy for electronic packaging prepared by spray deposition technique

Chong, T. / Guiyun, C. / Lin, Y.

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Study of movel 70% Si-Al alloy for electronic packaging prepared by spray deposition technique

Chong, T. / Guiyun, C. / Lin, Y.

Study of movel 70% Si-Al alloy for electronic packaging prepared by spray deposition technique

Chong, T. / Guiyun, C. / Lin, Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Study of movel 70% Si-Al alloy for electronic packaging prepared by spray deposition technique

Contributors:

Chong, T. (author) / Guiyun, C. (author) / Lin, Y. (author)

Published in:

PM TECHNOLOGY -CHINA- ; 23 ; 108-111

Publication date:

2005-01-01

Size:

4 pages

ISSN:

1001-3784

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 669

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