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Study of movel 70% Si-Al alloy for electronic packaging prepared by spray deposition technique
Study of movel 70% Si-Al alloy for electronic packaging prepared by spray deposition technique
Study of movel 70% Si-Al alloy for electronic packaging prepared by spray deposition technique
Chong, T. (author) / Guiyun, C. (author) / Lin, Y. (author)
PM TECHNOLOGY -CHINA- ; 23 ; 108-111
2005-01-01
4 pages
Article (Journal)
Unknown
DDC:
669
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