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    Bearing Life: A Future Package Cooling Challenge: Thermal Design for Cooling Microprocessor Packages

    New search for: Sauciuc, I.
    New search for: Prasher, R.
    New search for: Chang, J.-Y.
    New search for: Mahajan, R.
    New search for: Migliaccio, C.

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    Bearing Life: A Future Package Cooling Challenge: Thermal Design for Cooling Microprocessor Packages

    New search for: Sauciuc, I.
    New search for: Prasher, R.
    New search for: Chang, J.-Y.
    New search for: Mahajan, R.
    New search for: Migliaccio, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Bearing Life: A Future Package Cooling Challenge: Thermal Design for Cooling Microprocessor Packages

    New search for: Sauciuc, I.
    New search for: Prasher, R.
    New search for: Chang, J.-Y.
    New search for: Mahajan, R.
    New search for: Migliaccio, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Bearing Life: A Future Package Cooling Challenge: Thermal Design for Cooling Microprocessor Packages

    Contributors:

    Sauciuc, I. (author) / Prasher, R. (author) / Chang, J.-Y. (author) / Mahajan, R. (author) / Migliaccio, C. (author)

    Published in:

    ADVANCED PACKAGING ; 14 ; 24-27

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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