Growth behavior of Nb3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb: Fid-Bau Portal

Growth behavior of Nb3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb

Muranishi, Y. / Kajihara, M.

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Growth behavior of Nb3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb

Muranishi, Y. / Kajihara, M.

Growth behavior of Nb3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb

Muranishi, Y. / Kajihara, M.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Growth behavior of Nb3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb

Contributors:

Muranishi, Y. (author) / Kajihara, M. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 404 ; 33-41

Publication date:

2005-01-01

Size:

9 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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