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Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
Mita, M. (author) / Kajihara, M. (author) / Kurokawa, N. (author) / Sakamoto, K. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 403 ; 269-275
2005-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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