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Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package
Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package
Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package
Ukita, Y. (author) / Tateyama, K. (author) / Segawa, M. (author) / Tojo, Y. (author) / Gotoh, H. (author) / Oosako, K. (author)
ADVANCING MICROELECTRONICS ; 32 ; 8-11
2005-01-01
4 pages
Article (Journal)
English
DDC:
621.381
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