Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package
Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package
Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package
Ukita, Y. (Autor:in) / Tateyama, K. (Autor:in) / Segawa, M. (Autor:in) / Tojo, Y. (Autor:in) / Gotoh, H. (Autor:in) / Oosako, K. (Autor:in)
ADVANCING MICROELECTRONICS ; 32 ; 8-11
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
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