Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings: Fid-Bau Portal

Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings

Uenishi, K. / Kobayashi, K. F.

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Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings

Uenishi, K. / Kobayashi, K. F.

Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings

Uenishi, K. / Kobayashi, K. F.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings

Contributors:

Uenishi, K. (author) / Kobayashi, K. F. (author) / Naka, M. / Yamane, T.

Published in:

New Frontiers of Processing and Engineering in Advanced Materials ; 411-416

MATERIALS SCIENCE FORUM ; 502

Publication date:

2005-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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