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    Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate

    New search for: Takaku, Y.
    New search for: Liu, X. J.
    New search for: Ohnuma, I.
    New search for: Kainuma, R.
    New search for: Ishida, K.

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    Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate

    New search for: Takaku, Y.
    New search for: Liu, X. J.
    New search for: Ohnuma, I.
    New search for: Kainuma, R.
    New search for: Ishida, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate

    New search for: Takaku, Y.
    New search for: Liu, X. J.
    New search for: Ohnuma, I.
    New search for: Kainuma, R.
    New search for: Ishida, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate

    Contributors:

    Takaku, Y. (author) / Liu, X. J. (author) / Ohnuma, I. (author) / Kainuma, R. (author) / Ishida, K. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 45 ; 646-651

    Publication date:

    2004-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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