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Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems

Lee, W. / Myoung, J. M. / Yoo, Y. H. / Shin, H.

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Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems

Lee, W. / Myoung, J. M. / Yoo, Y. H. / Shin, H.

Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems

Lee, W. / Myoung, J. M. / Yoo, Y. H. / Shin, H.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems

Contributors:

Lee, W. (author) / Myoung, J. M. (author) / Yoo, Y. H. (author) / Shin, H. (author)

Published in:

COMPOSITES SCIENCE AND TECHNOLOGY ; 66 ; 435-443

Publication date:

2006-01-01

Size:

9 pages

ISSN:

0266-3538

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.118

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