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Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems
Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems
Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems
Lee, W. (Autor:in) / Myoung, J. M. (Autor:in) / Yoo, Y. H. (Autor:in) / Shin, H. (Autor:in)
COMPOSITES SCIENCE AND TECHNOLOGY ; 66 ; 435-443
01.01.2006
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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