Cooling rate and microstructure of rapidly solidified Al-20wt.% Si alloy: Fid-Bau Portal

Cooling rate and microstructure of rapidly solidified Al-20wt.% Si alloy

Xu, C. L. / Wang, H. Y. / Qiu, F. / Yang, Y. F. / Jiang, Q. C.

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Cooling rate and microstructure of rapidly solidified Al-20wt.% Si alloy

Xu, C. L. / Wang, H. Y. / Qiu, F. / Yang, Y. F. / Jiang, Q. C.

Cooling rate and microstructure of rapidly solidified Al-20wt.% Si alloy

Xu, C. L. / Wang, H. Y. / Qiu, F. / Yang, Y. F. / Jiang, Q. C.

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Title:

Cooling rate and microstructure of rapidly solidified Al-20wt.% Si alloy

Contributors:

Xu, C. L. (author) / Wang, H. Y. (author) / Qiu, F. (author) / Yang, Y. F. (author) / Jiang, Q. C. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 417 ; 275-280

Publication date:

2006-01-01

Size:

6 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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