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    Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

    New search for: Li, Y.
    New search for: Wong, C. P.

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    Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

    New search for: Li, Y.
    New search for: Wong, C. P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

    New search for: Li, Y.
    New search for: Wong, C. P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

    Contributors:

    Li, Y. (author) / Wong, C. P. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING R REPORTS -LAUSANNE- ; 51 ; 1-35

    Publication date:

    2006-01-01

    Size:

    35 pages

    ISSN:

    0927-796X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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