Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications: Fid-Bau Portal

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Li, Y. / Wong, C. P.

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Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Li, Y. / Wong, C. P.

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Li, Y. / Wong, C. P.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

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Titel:

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Beteiligte:

Li, Y. (Autor:in) / Wong, C. P. (Autor:in)

Erschienen in:

MATERIALS SCIENCE AND ENGINEERING R REPORTS -LAUSANNE- ; 51 ; 1-35

Erscheinungsdatum:

01.01.2006

Format / Umfang:

35 pages

ISSN:

0927-796X

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.1 / 530

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