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    Mechanical properties of porous and fully dense low-kappa dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique

    New search for: Xiang, Y.
    New search for: Chen, X.
    New search for: Tsui, T. Y.
    New search for: Jang, J.-I.
    New search for: Vlassak, J. J.

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    Mechanical properties of porous and fully dense low-kappa dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique

    New search for: Xiang, Y.
    New search for: Chen, X.
    New search for: Tsui, T. Y.
    New search for: Jang, J.-I.
    New search for: Vlassak, J. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Mechanical properties of porous and fully dense low-kappa dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique

    New search for: Xiang, Y.
    New search for: Chen, X.
    New search for: Tsui, T. Y.
    New search for: Jang, J.-I.
    New search for: Vlassak, J. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Mechanical properties of porous and fully dense low-kappa dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique

    Contributors:

    Xiang, Y. (author) / Chen, X. (author) / Tsui, T. Y. (author) / Jang, J.-I. (author) / Vlassak, J. J. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 21 ; 386-395

    Publication date:

    2006-01-01

    Size:

    10 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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