Bonding Technology for Electroless Ni-P Alloy Plating and Rubber: Fid-Bau Portal

Bonding Technology for Electroless Ni-P Alloy Plating and Rubber

Yan, H. / Yang, J.-m. / Li, H.-p.

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Bonding Technology for Electroless Ni-P Alloy Plating and Rubber

Yan, H. / Yang, J.-m. / Li, H.-p.

Bonding Technology for Electroless Ni-P Alloy Plating and Rubber

Yan, H. / Yang, J.-m. / Li, H.-p.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Bonding Technology for Electroless Ni-P Alloy Plating and Rubber

Contributors:

Yan, H. (author) / Yang, J.-m. (author) / Li, H.-p. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 39 ; 28-30

Publication date:

2006-01-01

Size:

3 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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